GGUANGNIANADHESIVE

5G Communications

Thermal & Shielding Bonding for 5G Equipment

Low-outgassing, high-thermal-conductivity adhesives for base stations, optical modules and high-speed connectors under high heat flux.

5G equipment power density is rising sharply, demanding more from TIMs and structural adhesives.

Our thermal structural adhesives cover 1.0–6.0 W/m·K with low bleeding and outgassing, suitable for chip packaging, filter cavities and full-unit assembly.

Need a custom bonding solution for your product?

Tell us the substrates, conditions and process requirements — our engineers respond within 24 hours.

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